Background

Most electronic assembly processes are performed by high-precision robotic systems. These systems are tasked to properly move and insert delicate components onto a circuit board. As a result, the assembly robots must be checked frequently for changes in alignment that can occur with routine use.

Challenge

To develop a machine application that can generate clear, verifiable data on how robotic manufacturing systems perform their very specific movements. This can help capture any changes in pressure or alignment in the production process, which can help reduce the risks of significant, costly errors.

Solution

Embedding pressure mapping technology into an assembly machine can help verify that all robotic elements are interfacing with the circuit board components properly. This data can help the operator take better command over their operation and confirm that the correct amount of force is applied in every movement. Integrating high-resolution pressure sensors, electronics, and customized software creates a seamless procedure for this sensitive process.

Other similar applications:

• Robotic chip placement
• Probe card testing
• Heat sinks
• Wafer polishing
• Chemical machine polishing (CMP)