Semiconductor Precision Clamping Pressure

Determine proper clamping pressure during computer chip or heat sink mounting.

Semiconductor Clamping Pressure Distribution

Challenge

Unknown clamping forces during computer chip and heat sink mounting or wafer probe testing can cause considerable product defects and quality issues. This can lead to lower yields and increased costs and product waste.

Solution

The I-Scan™ force and pressure mapping system is a key diagnostic and machine set-up tool for clamping fixtures. The ultra-thin (0.1 mm) sensors can be placed between any two mating surfaces, such as a heat sink and its heat source or a probe and wafer. The system allows for real-time viewing of the pressure distribution between the clamping fixture and opposing surface.

If the optimal pressure is not achieved, adjustments can be made to optimize the clamping fixture design, quantify forces, or determine ideal protocols such as torque patterns and procedures. The I-Scan pressure mapping system can be used to optimize pressure distribution prior to a testing sequence or production run, saving valuable company time and money. With the help of Tekscan's highly qualified sales and engineering support team, each system can be configured to meet your specific needs.

Progressive iterations of tooling, process, and/or fixturing adjustments yield more even pressure distribution across the area of interest.

Semiconductor Clamp Pressure distribution Applications

Coplanarization
Research and Development
Detect defects or obstructions
Before and after adjustment comparison
Quality assurance testing
Machine to machine comparison
Design verification testing

Benefits of Pressure Mapping

Better bonds and seals
Identify low yield machines
Increase manufacturing yields
Reduce costs and product waste
Provides data for improved design
Less wear and tear on production equipment
System Flexibility- can adapt to different or changing measurement needs

Gain Insights in the Semiconductor Manufacturing Process

Establishing and maintaining evenness between contacting surfaces is often both crucial and difficult to achieve. For testing and inspection in semiconductor manufacturing, this can be a key factor in order to produce a higher quality, or simply a functional product. Tactile pressure mapping technology from Tekscan gives engineers the insight needed for various applications in this field.

CMP Wafer pressure distribution during polishing process.