FOR IMMEDIATE RELEASE 

Tekscan Unveils a Real-Time Temperature Mapping System: The First of its Kind for Industrial Applications 

Norwood, MA, 4/16/2025 –  Tekscan, the global leader in tactile pressure and sensor technology and the most trusted partner in applied surface sensing, proudly announces the launch of its Temperature Mapping Solution—a first-of-its-kind system engineered to deliver real-time, spatially distributed temperature data in environments where traditional thermal imaging falls short.

This latest innovation builds on Tekscan’s legacy of sensor innovation and extends the capabilities of its I-Scan™ platform beyond pressure to deliver actionable, real-time thermal insights across a surface. Powered by I-Scan 9.5 software, the system combines a thin, flexible, and trimmable matrix temperature mapping sensor with the company’s existing Evolution™ Handle, offering engineers a scalable, full-system solution for temperature analysis.

“Tekscan’s Temperature Mapping Solution provides real-time visibility into thermal distribution across an entire surface,” said Camilo Aladro, Vice President of Product Engineering at Tekscan. “It enables engineers to detect anomalies, validate process performance, and ensure quality with unmatched precision—especially in applications where visual or point-based systems cannot do so.”

Key Features & Benefits

• Real-Time Spatial Temperature Mapping – Observe and quantify how temperature changes over time and space, enabling proactive troubleshooting and quality control.
• Measure Where Cameras Can’t – Accurately assess temperature behavior between surfaces and in obscured areas like nip pinch points or heat sink interfaces.
• Seamless Pressure + Temperature Integration – Use Tekscan’s I-Scan™ 9.5 software to capture both pressure and temperature simultaneously, for a holistic surface sensing solution.
• System-Level Solution – Goes beyond single-point or peak temperature validation to deliver full-field, dynamic mapping of thermal conditions.
• Versatile Industrial Use – Ideal for battery manufacturing, electronics thermal optimization, packaging heat seal validation, and process monitoring.
• Easy Upgrade Path for I-Scan Users – No major hardware overhaul needed; current I-Scan customers can integrate temperature sensing into their workflow seamlessly through an upgrade.

Market Impact & Applications

This Temperature Mapping Solution fills a critical gap in the industrial sensor space—providing an entirely new class of thermal insight that supports smarter design, better process control, and tighter quality assurance. Whether used in battery formation lines to monitor thermal behavior, in electronics to optimize heat dissipation, or in packaging to validate sealing temperatures, Tekscan’s new solution brings dynamic, high-resolution thermal data to areas previously out of reach.

“This launch represents more than a product—it's the next evolution of Tekscan’s vision to deliver complete surface sensing solutions,” explains John Jutila, Tekscan CEO. “As we continue to expand our measurement capabilities, we’re committed to providing engineers with the real-time insights they need to innovate with confidence.”

The system will be available for purchase April 30, 2025.

For more information, visit our Temperature Mapping system page.

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